Chiffres en millions de dollars américains. L'exercice financier va de février à janvier.
Breakdown
TTM
09/30/2025
09/30/2024
09/30/2023
09/30/2022
09/30/2021
Revenus
79
79
101
113
106
85
Croissance des revenus (H/H)
-22%
-22%
-11%
7%
25%
31%
Coût des ventes
52
52
64
73
66
50
Bénéfice brut
26
26
37
40
39
34
Vente, Général et Administration
28
28
33
41
28
23
Recherche et développement
2
2
4
7
--
--
Frais d'exploitation
31
31
37
49
34
29
Autres revenus (charges) non opérationnels
0
0
0
0
--
--
Bénéfice avant impôts
-27
-27
-7
-15
18
3
Charge d'impôt sur le revenu
2
2
0
-2
1
1
Bénéfice net
-30
-30
-8
-12
17
1
Croissance du bénéfice net
275%
275%
-33%
-171%
1,600%
-107%
Actions en circulation (diluées)
14.32
14.3
14.2
14.06
14.2
14.3
Variation des actions (H-H)
1%
1%
1%
-1%
-1%
1%
EPS (dilué)
-2.12
-2.12
-0.59
-0.89
1.22
0.11
Croissance du EPS
254.99%
254.99%
-33%
-173%
1,009%
-110%
Flux de trésorerie libre
6
6
4
-10
4
-8
Flux de trésorerie libre par action
--
--
--
--
--
--
Marge brute
32.91%
32.91%
36.63%
35.39%
36.79%
40%
Marge opérationnelle
-5.06%
-5.06%
0%
-7.96%
3.77%
4.7%
Marge bénéficiaire
-37.97%
-37.97%
-7.92%
-10.61%
16.03%
1.17%
Marge du flux de trésorerie libre
7.59%
7.59%
3.96%
-8.84%
3.77%
-9.41%
EBITDA
-2
-2
3
-4
5
5
Marge EBITDA
-2.53%
-2.53%
2.97%
-3.53%
4.71%
5.88%
D&A pour le résultat opérationnel
2
2
3
5
1
1
EBIT
-4
-4
0
-9
4
4
Marge EBIT
-5.06%
-5.06%
0%
-7.96%
3.77%
4.7%
Taux d'imposition effectif
-7.4%
-7.4%
0%
13.33%
5.55%
33.33%
Statistiques clés
Clôture préc.
$11.49
Prix d'ouverture
$11.72
Plage de la journée
$10.89 - $11.85
Plage de 52 semaines
$3.2 - $18.59
Volume
362.1K
Volume moyen
287.3K
BPA (TTM)
-2.12
Rendement en dividend
--
Capitalisation boursière
$168.1M
Qu’est-ce que ASYS ?
Amtech Systems, Inc. engages in the manufacture of semiconductors and capital equipment. The company is headquartered in Tempe, Arizona and currently employs 264 full-time employees. The Company’s segment includes Thermal Processing Solutions and Semiconductor Fabrication Solutions. The Thermal Processing Solutions include reflow equipment for chip packaging and electronic assembly, diffusion furnaces and furnaces used to produce ceramic-based power semiconductor packages and passive electronic components. The Semiconductor Fabrication Solutions include consumables, equipment and services for wafer polishing, cleaning, slicing and dicing. The company sells process equipment and services used in the fabrication of semiconductor devices, such as silicon carbide (SiC), silicon power, electronic assemblies and modules to semiconductor device and module manufacturers globally, particularly in Asia, North America and Europe.