Hua Hong Semiconductor Limited Dividend Information
Hua Hong Semiconductor Limited has an annual dividend of 0.5852 per share, with a yield of 0.00%. The dividend is paid annually and the last ex-dividend date was Jun 3, 2024.
Dividend Yield
Annual Dividend
Ex-Dividend Date
0.00%
$0.5852
Jun 3, 2024
Payout Frequency
Payout Ratio
Annually
0.00%
Dividend History
Ex-Dividend Date
Cash Amount
Record Date
Pay Date
Jun 3, 2024
$0.165
Jun 4, 2024
Jun 26, 2024
May 14, 2019
$0.31
May 15, 2019
Jun 26, 2019
Dividend Charts
HHUSF Dividends
HHUSF Dividend Growth (YoY)
Key Stats
Prev.Close
$10.32
Open
$11.9
Day's Range
$11.9 - $11.9
52 week range
$2.7 - $12.1
Volume
108
Avg.Volume
57
EPS (TTM)
0.02
Dividend yield
--
Market Cap
$15.7B
What is Hua Hong Semiconductor Ltd?
Hua Hong Semiconductor Ltd is a CN-based company operating in Semiconductors & Semiconductor Equipment industry. The company is headquartered in Shanghai, Shanghai and currently employs 7,487 full-time employees. The company went IPO on 2014-10-15. Hua Hong Semiconductor Ltd is an investment holding company primarily engaged in the manufacture and sale of semiconductor products. The Company’s main business is engaged in the provision of wafer foundry and supporting services for diversified specialty process platforms including embedded/standalone non-volatile memory, power discrete, analog and power management, logic and radio frequency (RF) and others. The Company’s products end markets include consumer electronics, industrial and automotive electronics, communications products and computers. The firm is also engaged in the real estate development and leasing business. The firm conducts its business in domestic and overseas markets.